| Mfg Part Number: AS57C512-20ECM | Alternate P/N: AS57C51220ECM | Manufacturer: Austin Semiconductor Inc |
| NSN : 5962-01-333-2528 | Item Name : microcircuit memory | CAGE Code : 0EU86 |
| FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN 5962-01-333-2528 manufactured by Austin Semiconductor Inc. The particular NSN product you are looking for is listed alongside the part number AS57C512-20ECM, and is described as Microcircuit Memory. As we have this item available, we invite you to request a quote for your comparisons by filling out our RFQ form below. Once you have completed our form, we ask that you provide us with details regarding target prices, quantities, and expected shipping time frame. In this way, we can provide you with a quote that meets your specifications and requirements.
Beyond NSN 5962-01-333-2528 manufactured under CAGE Code 0EU86, and other various Austin Semiconductor Inc parts, Acquire NSN has a stock inventory of over 2 billion new, used, obsolete, and hard-to-find NSN parts AS57C512-20ECM that work to meet the needs of a variety of industry verticals and applications. Acquire NSN operates under AS9120B and ISO 9001:2015 certification and FAA AC 00-56B accreditation to ensure the quality and authenticity of our offerings. We have developed an interface that simplifies the purchasing process with rapid response times for the industries we serve. Get started on the procurement process today and see why customers steadily rely on Acquire NSN for all their operational needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-333-2528 Item Description: Microcircuit Memory | 5962 | 013332528 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| As57c512-20ecm | 1 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 350.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 60.00 MILLIAMPERES MAXIMUM SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | EPROM |
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