| Mfg Part Number: 20V8B-15LD 883 | Alternate P/N: 20V8B15LD883 | Manufacturer: E2v Inc |
| NSN : 5962-01-644-8653 | Item Name : microcircuit memory | CAGE Code : 0C7V7 |
| FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN 5962-01-644-8653 manufactured by E2v Inc. The particular NSN product you are looking for is listed alongside the part number 20V8B-15LD 883, and is described as Microcircuit Memory. As we have this item available, we invite you to request a quote for your comparisons by filling out our RFQ form below. Once you have completed our form, we ask that you provide us with details regarding target prices, quantities, and expected shipping time frame. In this way, we can provide you with a quote that meets your specifications and requirements.
Beyond NSN 5962-01-644-8653 manufactured under CAGE Code 0C7V7, and other various E2v Inc parts, Acquire NSN has a stock inventory of over 2 billion new, used, obsolete, and hard-to-find NSN parts 20V8B-15LD 883 that work to meet the needs of a variety of industry verticals and applications. Acquire NSN operates under AS9120B and ISO 9001:2015 certification and FAA AC 00-56B accreditation to ensure the quality and authenticity of our offerings. We have developed an interface that simplifies the purchasing process with rapid response times for the industries we serve. Get started on the procurement process today and see why customers steadily rely on Acquire NSN for all their operational needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-644-8653 Item Description: Microcircuit Memory | 5962 | 016448653 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 20v8b-15ld 883 | 1 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | PROGRAMMABLE PAL 20V8" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.0 NANOSECONDS MAXIMUM ACCESS" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | PROGRAMMABLE PAL 20V8" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.0 NANOSECONDS MAXIMUM ACCESS" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
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